N. S. Morgan and N. J. Ginga, "Characterization of Mechanical Behavior of Porous Conductive PDMS-CNT/Graphene Based Foams Under Multidirectional Strain for Flexible/Stretchable Electronics," 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), Dallas, TX, USA, 2025, pp. 1558-1563, doi: 10.1109/ECTC51687.2025.00266.
Knee, W, & Ginga, NJ. "Multiscale Quasi-Static Finite Element Analysis of Commercial Lithium Primary Batteries." Proceedings of the ASME 2024 International Mechanical Engineering Congress and Exposition. Volume 6: Energy. Portland, Oregon, USA. November 17–21, 2024. V006T08A056. ASME. https://doi.org/10.1115/IMECE2024-142525
Sahu, A., Ginga, N.J., "Modifying a controlled diffusion microfluidic device through applications of tunable width channels based on PDMS nanocracks." 28th International Conference on Miniaturized Systems for Chemistry and Life Sciences (MicroTAS). Montreal, Canada. 10/13/2024. https://doi.org/10.70477/akec4664
N.S. Morgan, K.U. Godbole, B.G. Stewart, S.K. Sitaraman and N.J. Ginga, "Investigation of Mechanical Reliability of Flexible/Stretchable Electronic Materials Using Multi-Axial Stretch Techniques," 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), Denver, CO, USA, 2024, pp. 1003-1010, doi: 10.1109/ECTC51529.2024.00161.
Ginga, N.J., Slyman, R. (2024). BOOK CHAPTER: Double-Barrel Perfusion System for Modification of Luminal Contents of Intestinal Organoids. In: Sumbalova Koledova, Z. (eds) 3D Cell Culture. Methods in Molecular Biology, vol 2764. Humana, New York, NY. https://doi.org/10.1007/978-1-0716-3674-9_14.
N. J. Ginga, R. Chen and S. K. Sitaraman, "Magnetic Force-Based Measurement Technique to Investigate the Effect of Lead-Free Solder Intermetallic Compounds (IMC) on Interconnect Reliability," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 297-302, https://doi.org/10.1109/ECTC51909.2023.00057.
J.H. Lee, J.H.C. Chiu, N.J. Ginga, T Ahmed, M.D. Thouless, Y. Liu, S. Takayama, “Super-resolution imaging of linearized chromatin in tunable nanochannels,” Nanoscale Horizons, 2023, 8, 1043-1053, https://doi.org/10.1039/D3NH00096F.
N. J. Ginga, S. K. Sitaraman, "Cohesive fracture measurement technique for free-hanging thin films using highly stressed superlayer", Thin Solid Films, Volume 757, 2022, 139379, ISSN 0040-6090, https://doi.org/10.1016/j.tsf.2022.139379.
N. J. Ginga and S. K. Sitaraman, "Thermomechanical Reliability Investigation of Carbon Nanotube Off-Chip Interconnects for Electronic Packages," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 12, no. 8, pp. 1282-1292, Aug. 2022, https://doi.org/10.1109/TCPMT.2022.3194163.
R. Chen, N. J. Ginga, and S. K. Sitaraman, "Magnetic Actuation Metrology for Interfacial Adhesion Measurement with Environmental Conditions." 2022, TECHCON 2022, https://www.src.org/library/publication/p107706/.
N.J. Ginga, J.H.C. Chiu, J.H. Lee, M.D. Thouless, S. Takayama, “High-force, precise, and bidirectional uniaxial stretcher for real-time imaging of normally closed h-PDMS crack-valves for femto-liter fluid delivery,” Microfluidics and Nanofluidics 26, 27 (2022). https://doi.org/10.1007/s10404-022-02533-3.
N. J. Ginga, R. Slyman, G. -A. Kim, E. Parigoris, S. Huang, V. K. Yadagiri, V. B. Young, J. R. Spence, S. Takayama, “Perfusion System for Modification of Luminal Contents of Human Intestinal Organoids and Realtime Imaging Analysis of Microbial Populations,” Micromachines 2022, 13, 131. https://doi.org/10.3390/mi13010131.
R. Chen, N. J. Ginga and S. K. Sitaraman, "Magnetic-Based Interfacial Adhesion Measurement Technique with Environmental Conditions," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022, pp. 1594-1601, https://doi.org/10.1109/ECTC51906.2022.00254.
R. Chen, N. J. Ginga, and S. K. Sitaraman, "Magnetic Actuation Metrology for Interfacial Adhesion Measurement," 2021, TECHCON 2021, https://www.src.org/library/publication/p104068/.
R. Chen, N. J. Ginga and S. K. Sitaraman, "Magnetically Actuated Test Method for Interfacial Fracture Reliability Assessment," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2021, pp. 802-810, https://doi.org/10.1109/ECTC32696.2021.00138.
B. G. Stewart, N. J. Ginga and S. K. Sitaraman, "Biaxial Inflation Stretch Test for Printed Electronics," 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2020, pp. 1106-1113, https://doi.org/10.1109/ECTC32862.2020.00178.
Y. Chen, N. J. Ginga, W. S. LePage, E. Kazyak, A. J. Gayle, J. Wang, R. E. Rodríguez, M. D. Thouless, and N. P. Dasgupta, “Enhanced Interfacial Toughness of Thermoplastic–Epoxy Interfaces Using ALD Surface Treatments,” ACS Applied Materials & Interfaces 2019 11 (46), 43573-43580, https://doi.org/10.1021/acsami.9b15193.
G. -A. Kim, N. J. Ginga, S. Takayama, “Integration of Sensors in Gastrointestinal Organoid Culture for Biological Analysis,” Cellular and Molecular Gastroenterology and Hepatology, Volume 6, Issue 1, 2018, Pages 123-131.e1, ISSN 2352-345X, https://doi.org/10.1016/j.jcmgh.2018.03.002.
N. J. Ginga, “On-Chip Dielectric Cohesive Fracture Characterization and Mitigation Investigation Through Off-Chip Carbon Nanotube Interconnects,” Georgia Institute of Technology, 2014.
N. J. Ginga, W. Chen, S. K. Sitaraman, “Waviness reduces effective modulus of carbon nanotube forests by several orders of magnitude,” Carbon, Volume 66, 2014, Pages 57-66, ISSN 0008-6223, https://doi.org/10.1016/j.carbon.2013.08.042.
N. J. Ginga, S. K. Sitaraman, “The experimental measurement of effective compressive modulus of carbon nanotube forests and the nature of deformation,” Carbon, Volume 53, 2013, Pages 237-244, ISSN 0008-6223, https://doi.org/10.1016/j.carbon.2012.10.054.
N. J. Ginga, S. K. Sitaraman, “New Method to Measure Tensile Strength of Low Modulus Thin Films”. Int J Fract 170, 199–206 (2011). https://doi.org/10.1007/s10704-011-9610-1.
J. Zheng, M. Modi, N. J. Ginga and S. K. Sitaraman, "Silicon and Nanoscale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods," in IEEE Transactions on Components and Packaging Technologies, vol. 32, no. 2, pp. 333-338, June 2009, doi: 10.1109/TCAPT.2009.2021699.
M. B. Modi, N. J. Ginga and S. K. Sitaraman, "Microcontact Spring Reliability: Design Against Interfacial Fracture," in IEEE Transactions on Components and Packaging Technologies, vol. 32, no. 1, pp. 197-206, March 2009, doi: 10.1109/TCAPT.2008.2010131.
J. Zheng, M. Modi, N. J. Ginga and S. K. Sitaraman, "Silicon, Low-K Dielectric, and Nano-Scale Metal Interface Characterization Using Stress-Engineered Superlayer Test Methods," 2007 Proceedings 57th Electronic Components and Technology Conference, Sparks, NV, USA, 2007, pp. 1384-1389, doi: 10.1109/ECTC.2007.373975.
Keywords: stretchable electronics, flexible electronics, conductive inks, printed electronics, nanomaterials, carbon nanotubes, graphene, silver nanowires, wearable sensors, soft electronics, polymer substrates, TPU, PDMS, electromechanical reliability, mechanical testing, fracture mechanics, finite element modeling, FEA, multiaxial strain, thin film cracking, additive manufacturing, direct ink writing, printed multilayer circuits, printed vias, in-space manufacturing, NASA electronics, mechanical modeling, structural health monitoring, soft robotics, biomedical electronics, aerospace electronics, Radial Stretch Tester, electromechanical fatigue, stretchable circuit design