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Projects
Cohesive and interfacial fracture and delamination of thin films
Development of custom wedge tester device for interfacial fracture and delamination measurement.
Measured interfacial fracture toughness of electrically conductive inks and adhesives used in flexible electronics.
Stress engineered thin films for interfacial and cohesive fracture of thin films/layers.
Stressed chromium thin films used to measure the cohesive fracture toughness of nanoscale silicon dioxide thin films.
Mechanical reliability of flexible and rigid electronics
Development of mechanical characterization methods for flexible electronics
Multi-axial stretch system - Develop multi-axial stretch systems to characterize mechanical and electrical performance of stretchable electronics subjected to monotonic and cyclic loads
Finite element analysis of flexible and rigid electronics
RSS HD faster motor 2024 jan.mp4Finite element analysis of flexible and rigid electronics
Flexible capacitor subjected to bending
Flexible capacitor subjected to bending
Finite element models of rigid flipchips using traditional solder balls and carbon nanotube (CNT) interconnects
Finite element models of rigid flipchips using traditional solder balls and carbon nanotube (CNT) interconnects
Controlled cracking/fracture for small scale fabrication of devices
Fabricate nano-valves in PDMS using controlled cracking. Width of valves are fully adjustable from open to closed using application of external force.
Femto-liter fluid volume delivery control
Krypton Sputtering of Space craft materials caused by electronic propulsion systems
Mechanical characterization and finite element analysis of battery materials
Keywords: stretchable electronics, flexible electronics, conductive inks, printed electronics, nanomaterials, carbon nanotubes, graphene, silver nanowires, wearable sensors, soft electronics, polymer substrates, TPU, PDMS, electromechanical reliability, mechanical testing, fracture mechanics, finite element modeling, FEA, multiaxial strain, thin film cracking, additive manufacturing, direct ink writing, printed multilayer circuits, printed vias, in-space manufacturing, NASA electronics, mechanical modeling, structural health monitoring, soft robotics, biomedical electronics, aerospace electronics, Radial Stretch Tester, electromechanical fatigue, stretchable circuit design
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